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GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
4 linked items ·October 10, 2026 → October 23, 2026· All threads
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
October 10, 2026 ·Chips desk ·Open that day's brief
Analysis: TSMC-GF deal moves mature nodes into AI packaging: What it means for China
October 16, 2026 ·Chips desk ·Open that day's brief
TSMC and others turn LCD plants into AI assets as LG Innotek weighs acquisition
October 21, 2026 ·Chips desk ·Open that day's brief
TSMC advances CoPoS packaging at Taoyuan Longtan site
October 23, 2026 ·Chips desk ·Open that day's brief